技术参数
- Package / Case 153-TFBGA
- Mounting Type Surface Mount
- Memory Size 2Tbit
- Memory Type Non-Volatile
- Operating Temperature -40°C ~ 85°C
- Voltage - Supply 2.7V ~ 3.6V
- Technology FLASH - NAND (TLC)
- Clock Frequency 200 MHz
- Memory Format FLASH
- Supplier Device Package 153-BGA (11.5x13)
- Memory Interface eMMC
- Memory Organization 256G x 8
- ECCN 3A991B1A
- HTSUS 8542.32.0071
- Moisture Sensitivity Level (MSL) 3 (168 Hours)
- RoHS Status ROHS3 Compliant
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