技术细节
- 安装类型 Module
- 等效串联电阻 0.984" L x 0.939" W (25.00mm x 23.86mm)
- 匝数 Chassis Mount
- 插入材料 CSI-2, MIPI
- 介电材料 CMOS
- 操作力 - 中压 1.4µm x 1.4µm
- 传输速率 4608 x 2592
- 尖端形状 0.453" (11.50mm)
- Rolling
- IMX708
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